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arXiv · 1701.00282

Vacuum Quality Monitoring of Analytical Sputter Depth Profile Equipment by Recontamination Measurements of a Sputtered Ti Surface

Uwe Scheithauer
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Abstract

Often a surface sensitive analytical technique in combination with sample erosion by inert ion sputtering is used for compositional in-depth analysis of solid state samples. Layer by layer the sample gets eroded and then the composition of the actual surface is estimated. The elemental detection limits can be increased by spending more time for the measurement in each sputter depth of the profile measurement. But during this time a significant sample surface recontamination with the element under investigation via adsorption form the vacuum has to be avoided. Commonly the vacuum quality of an analytical instrument is monitored using the base pressure of the UHV system. This article presents a novel method, which improves this crude approach. The recontamination of a sputtered Ti surface by adsorbed residual gas particles was used to monitor the sputter depth profile specific vacuum condition of an XPS microprobe Quantum 2000 over a 4 years period. This new method is suitable to monitor the condition of every sputter depth profiling instrument.

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Uwe Scheithauer. 2017-01-01. Vacuum Quality Monitoring of Analytical Sputter Depth Profile Equipment by Recontamination Measurements of a Sputtered Ti Surface. https://arxiv.org/abs/1701.00282

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