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arXiv · 1709.10069

An Extended Analytic Model for the Heating of Bondwires

David Duque·Tomas Gotthans·Renaud Gillon·Sebastian Schöps
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Abstract

We present an extended analytic formula for the calculation of the temperature profile along a bondwire embedded in a package. The resulting closed formula is built by coupling the heat transfer equations of the bondwire and the surrounding moulding compound by means of auxiliary variables that stem from an \emph{ad-hoc} linearisation and mediate the wire-mould thermal interaction. The model, which corrects typical simplifications in previously introduced analytic models, is also optimised against carefully taken experimental samples representing fusing events of bondwires within real packages.

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David Duque, Tomas Gotthans, Renaud Gillon, Sebastian Schöps. 2017-09-28. An Extended Analytic Model for the Heating of Bondwires. https://arxiv.org/abs/1709.10069

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