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arXiv · 2002.04220

Impact of body thickness and scattering on III-V triple heterojunction Fin-TFET modeled with atomistic mode space approximation

Chin-Yi Chen·Hesameddin Ilatikhameneh·Jun Z. Huang·Gerhard Klimeck·Michael Povolotskyi
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Abstract

The triple heterojunction TFET has been originally proposed to resolve TFET's low ON-current challenge. The carrier transport in such devices is complicated due to the presence of quantum wells and strong scattering. Hence, the full band atomistic NEGF approach, including scattering, is required to model the carrier transport accurately. However, such simulations for devices with realistic dimensions are computationally unfeasible. To mitigate this issue, we have employed the empirical tight-binding mode space approximation to simulate triple heterojunction TFETs with the body thickness up to 12 nm. The triple heterojunction TFET design is optimized using the model to achieve a sub-60mV/dec transfer characteristic under realistic scattering conditions.

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Chin-Yi Chen, Hesameddin Ilatikhameneh, Jun Z. Huang, Gerhard Klimeck, Michael Povolotskyi. 2020-02-11. Impact of body thickness and scattering on III-V triple heterojunction Fin-TFET modeled with atomistic mode space approximation. https://doi.org/10.1109/ted.2020.3002220

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