Mechanisms of jump to contact and conductance plateau formation in copper atomic junctions in vacuum and aqueous environments

Abstract

The interplay between groups of water molecules and single-atom contacts, as reflected in the electrical conductances and mechanical forces of copper atomic junctions, is explored by means of first-principles theory and semi-empirical calculations. We study the influence of the atomic geometries of copper electrodes with pyramidal and non-crystalline structures in the presence and absence of water on the conductance profiles as the electrodes approach each other. It is shown that the atomic arrangements of nano-contacts have crucial effects on the formation of plateaus and the conductance values. Groups of hydrogen bonded water molecules bridge the junction electrodes before a direct Cu-Cu contact between the electrodes is made. However, the bridging of the two copper electrodes by a single H$_{2}$O molecule only occurs in the junctions with pyramidal electrodes. Our findings reveal that the presence of H$_{2}$O molecules modifies strongly the conductance profile of these junctions. In the absence of water molecules, the pyramidal junctions exhibit continuous transitions between integer conductance plateaus, while in the presence of H$_{2}$O molecules, these junctions show abrupt jump to contact behavior and no well-defined conductance plateaus. By contrast, in the absence of H$_{2}$O molecules, the non-crystalline junctions display jump to contact behavior and no well-defined plateaus, while in the presence of H$_{2}$O molecules they exhibit a jump to contact and abrupt transitions between fractional and integer plateaus.