Search arXivSearch

arXiv · 2011.08125

Fabrication, characterization, and simulation of glass devices with AlN-thin-film-transducers for excitation of ultrasound resonances

Abstract

We present fabrication of 570-um-thick, millimeter-sized soda-lime-silicate float glass blocks with a 1-um-thick AlN-thin-film piezoelectric transducer sandwiched between thin metallic electrodes and deposited on the top surface. The electro-mechanical properties are characterized by electrical impedance measurements in the frequency range from 0.1 to 10 MHz with a peak-to-peak voltage of 0.5 V applied to the electrodes. We measured the electrical impedance spectra of 35 devices, all of width 2 mm, but with 9 different lengths ranging from 2 to 6 mm and with 2-7 copies of each individual geometry. Each impedance spectrum exhibits many resonance peaks, of which we carefully measured the 5 most prominent ones in each spectrum. We compare the resulting 173 experimental resonance frequencies with the simulation result of a finite-element-method model that we have developed. When using material parameters from the manufacturer, we obtain an average relative deviation of the 173 simulated resonance frequencies from the experimental ones of (-4.2 +/-0.04)%. When optimizing the values of the Young's modulus and the Poisson ratio of the float glass in the simulation, this relative deviation decreased to (-0.03 +/- 0.04)%. Our results suggest a method for an accurate in-situ determination of the acoustic parameters at ultrasound frequencies of any elastic solid onto which a thin-film transducer can be attached

Explore related subjects

Keep this discovery

Explore connections, maps & timelines

BibTeXRIS

André G. Steckel, Henrik Bruus, Paul Muralt, Ramin Matloub. 2020-11-16. Fabrication, characterization, and simulation of glass devices with AlN-thin-film-transducers for excitation of ultrasound resonances. https://doi.org/10.1103/physrevapplied.16.014014

Cite the original work for its findings. Save a collection to share your selection of sources.

KEEP EXPLORING

Related papers

Measuring vacancy-type defect density in monolayer semiconductors

Two-dimensional (2D) materials have attracted wide-spread interest due to their unique and tunable properties. Their optoelectronic, mechanical, and thermal properties are greatly influenced by crystal defects, which are, in turn, used to control these properties. However, experimental quantification of the density of defects, whether deliberately introduced or inherent, is very difficult in these atomically thin materials. Here we show that helium atom micro-diffraction can be used to measure the defect density in ~15x20um monolayer MoS2, a prototypical 2D semiconductor, quickly and easily compared to standard methods. We present a simple analytic model, the lattice gas equation, that captures the relationship between atomic Bragg diffraction intensity and defect density. The model, combined with ab initio scattering calculations, shows that our technique can immediately be applied to a wide range of 2D materials, independent of sample chemistry or structure. Additionally, wafer-scale characterization is immediately possible.

physics.app-ph

Compact Modeling of Oxide-Semiconductor, 2D Material, Carbon Nanotube, and Cryogenic Transistors with Experiment Verification

This paper presents a unified compact model for emerging transistor technologies, including oxide-semiconductor field-effect transistors (OSFETs), 2D material FETs (2DFETs), carbon nanotube FETs (CNFETs), and cryogenic MOSFETs. A unified charge-density formulation is developed to account for quantum confinement, trap charges, and band-tail states in channel charge calculations. A physics-based transport model is introduced to seamlessly capture carrier transport from the long-channel diffusive regime to the short-channel ballistic limit. Scaling models are incorporated to accurately describe 2D electrostatic effects. Cryogenic operation is modeled through the inclusion of band-tail states and temperature-dependent mobility and threshold voltage. The proposed model is validated against experimental data from the fabricated OSFETs with multiple channel lengths and published measurements of 2DFETs, CNFETs, and cryogenic MOSFETs. Excellent agreement is demonstrated across diverse device architectures, operating conditions, and material systems.

physics.app-ph

Multiplexing approaches to thermoradiative signatureless communications

Using mid-infrared emission from semiconductor devices for covert communications remains a relatively unexplored and yet promising opportunity. The phenomenon of negative luminescence allows for a method of signatureless covert communications where the net infrared emission of an emitting optoelectronic device is balanced to be identical to the ambient thermal background. In this work we provide a practical demonstration of covert data transfer over a thermoradiative channel with data rates up to 100 kbps. In addition, we demonstrate several additional multiplexing techniques that make the proposed thermoradiative communications method more secure against interception by achieving zero instantaneous optical emission, while remaining detectable if a sufficiently spatially or spectrally discerning observation is utilised. Finally, we discuss various application scenarios in which the proposed methods can be used to achieve secure signatureless communications.

physics.app-ph