Search arXivSearch

arXiv · 2403.13655

A Fully Automated Platform for Evaluating ReRAM Crossbars

Abstract

Resistive Random Access Memory (ReRAM) is a promising candidate for implementing Computing-in-Memory (CIM) architectures and neuromorphic circuits. ReRAM cells exhibit significant variability across different memristive devices and cycles, necessitating further improvements in the areas of devices, algorithms, and applications. To achieve this, understanding the stochastic behavior of the different ReRAM technologies is essential. The NeuroBreakoutBoard (NBB) is a versatile instrumentation platform to characterize Non-Volatile Memories (NVMs). However, the NBB itself does not provide any functionality in the form of software or a controller. In this paper, we present a control board for the NBB able to perform reliability assessments of 1T1R ReRAM crossbars. In more detail, an interface that allows a host PC to communicate with the NBB via the new control board is implemented. In a case study, we analyze the Cycle-to-Cycle (C2C) variation and read disturb TiN/Ti/HfO2/TiN cells for different read voltages to gain an understanding of their operational behavior.

Explore related subjects

Keep this discovery

Explore connections, maps & timelines

BibTeXRIS

Rebecca Pelke, Felix Staudigl, Niklas Thomas, Nils Bosbach, Mohammed Hossein, Jose Cubero-Cascante, Leticia Bolzani Poehls, Rainer Leupers, Jan Moritz Joseph. 2024-03-20. A Fully Automated Platform for Evaluating ReRAM Crossbars. https://arxiv.org/abs/2403.13655

Cite the original work for its findings. Save a collection to share your selection of sources.

KEEP EXPLORING

Related papers

Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration

The scaling of GPUs for AI and HPC workloads is increasingly constrained by the capacity, bandwidth, and thermal limits of both 2.5D HBM-GPU and direct-stacked 3D HBM-on-GPU integration. This work establishes the thermal design envelope for 3D volumetric DRAM-on-GPU integration, in which vertically oriented DRAM dies and interleaved cooling cavities reshape heat flow and memory interfacing above the GPU. Using a package-level thermal model anchored to a consistent HBM-on-GPU baseline and driven by a realistic reticle-scale non-uniform GPU power map, we quantify the key parameters governing thermal feasibility. Stack height is the dominant limiter of peak temperature, while cooling-cavity conductivity shifts the feasible region, and mold insertion and stack orientation further modulate thermal behavior. A distributed memory-controller and network-on-chip tier introduces only a moderate thermal penalty. Although die-level parallelism increases bandwidth, the reduction in simulated training time saturates once execution becomes compute-bound. These results define a bounded co-design space across bandwidth, capacity, and thermal constraints for 3D volumetric DRAM-on-GPU integration.

cs.ET

Droop-Aware Foundation Model Power Flow

This paper develops a droop-aware extension of the GridFM power systems foundation model, embedding droop gains and frequency/voltage deadband parameters as per-bus node features to enable control-aware AC power-flow analysis. Existing power-flow datasets encode only static electrical features, conflating operating points from qualitatively different control regimes; this work resolves that gap by exposing droop and deadband parameters as structured node features, with deadband discontinuities handled through a smooth tanh approximation that preserves solver differentiability. A transformer-based graph neural network is pre-trained on masked reconstruction and fine-tuned on the resulting control-aware datasets. The framework is validated against PSCAD electromagnetic-transient simulations on a two-bus system (0.11% maximum steady-state error) and cross-validated against an independent PyPower droop solver on the IEEE 24-bus RTS. On the 24-bus system the surrogate attains R2 = 0.9996 for active generation and 0.0015 p.u. voltage-magnitude RMSE; scalability is confirmed on the IEEE 300-bus system (0.0036 p.u. RMSE, R2 = 0.9841 for voltage magnitude across 299,700 predictions). A three-mode control study further shows that the deadband widens the control-error distribution while leaving total droop compensation unchanged, establishing deadband width as an actionable node-level design feature.

cs.ET

GNN-based Path-aware multi-view Circuit Learning for Technology Mapping

Traditional technology mapping suffers from systemic inaccuracies in delay estimation due to its reliance on abstract, technology-agnostic delay models that fail to capture the nuanced timing behavior behavior of real post-mapping circuits. To address this fundamental limitation, we introduce GPA(graph neural network (GNN)-based Path-Aware multi-view circuit learning), a novel GNN framework that learns precise, data-driven delay predictions by synergistically fusing three complementary views of circuit structure: And-Inverter Graphs (AIGs)-based functional encoding, post-mapping technology emphasizes critical timing paths. Trained exclusively on real cell delays extracted from critical paths of industrial-grade post-mapping netlists, GPA learns to classify cut delays with unprecedented accuracy, directly informing smarter mapping decisions. Evaluated on the 19 EPFL combinational benchmarks, GPA achieves 19.9%, 2.1% and 4.1% average delay reduction over the conventional heuristics methods (techmap, MCH) and the prior state-of-the-art ML-based approach SLAP, respectively-without compromising area efficiency.

cs.ET