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arXiv · 2405.04104

A Multi-Module Silicon-On-Insulator Chip Assembly Containing Quantum Dots and Cryogenic Radio-Frequency Readout Electronics

David J. Ibberson·James Kirkman·John J. L. Morton·M. Fernando Gonzalez-Zalba·Alberto Gomez-Saiz
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Abstract

Quantum processing units will be modules of larger information processing systems containing also digital and analog electronics modules. Silicon-based quantum computing offers the enticing opportunity to manufacture all the modules using the same technology platform. Here, we present a cryogenic multi-module assembly for multiplexed readout of silicon quantum devices where all modules have been fabricated using the same fully-depleted silicon-on-insulator (FDSOI) CMOS process. The assembly is constituted by three chiplets: (i) a low-noise amplifier (LNA), (ii) a single-pole eight-throw switch (SP8T), and (iii) a silicon quantum dot (QD) array. We integrate the chiplets into modules and show respectively, (i) a peak gain over 35dB with a 3dB bandwidth from 709MHz to 827MHz and an average noise temperature of 6.2K (minimum 4.2K), (ii) an insertion loss smaller than 1.1dB and a noise temperature less than 1.1K over the 0-2GHz range, and (iii) single-electron box (SEB) charge sensors. Finally, we combine all modules into a single demonstration showing time-domain radio-frequency multiplexing of two SEBs paving the way to an all-silicon quantum computing system.

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David J. Ibberson, James Kirkman, John J. L. Morton, M. Fernando Gonzalez-Zalba, Alberto Gomez-Saiz. 2024-11-21. A Multi-Module Silicon-On-Insulator Chip Assembly Containing Quantum Dots and Cryogenic Radio-Frequency Readout Electronics. https://doi.org/10.1109/icecs61496.2024.10848854

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