Search arXivSearch

arXiv · 2509.13964

Analytical Modelling of the Transport in Analog Filamentary Conductive-Metal-Oxide/HfOx ReRAM Devices

Abstract

The recent co-optimization of memristive technologies and programming algorithms enabled neural networks training with in-memory computing systems. In this context, novel analog filamentary conductive-metal-oxide (CMO)/HfOx redox-based resistive switching memory (ReRAM) represents a key technology. Despite device performance enhancements reported in literature, the underlying mechanism behind resistive switching is not fully understood. This work presents the first physics-based analytical model of the current transport and of the resistive switching in these devices. As a case study, analog TaOx/HfOx ReRAM devices are considered. The current transport is explained by a trap-to-trap tunneling process, and the resistive switching by a modulation of the defect density within the sub-band of the TaOx that behaves as electric field and temperature confinement layer. The local temperature and electric field distributions are derived from the solution of the electric and heat transport equations in a 3D finite element ReRAM model. The intermediate resistive states are described as a gradual modulation of the TaOx defect density, which results in a variation of its electrical conductivity. The drift-dynamics of ions during the resistive switching is analytically described, allowing the estimation of defect migration energies in the TaOx layer. Moreover, the role of the electro-thermal properties of the CMO layer is unveiled. The proposed analytical model accurately describes the experimental switching characteristic of analog TaOx/HfOx ReRAM devices, increasing the physical understanding and providing the equations necessary for circuit simulations incorporating this technology.

Explore related subjects

Keep this discovery

Explore connections, maps & timelines

BibTeXRIS

Donato Francesco Falcone, Stephan Menzel, Tommaso Stecconi, Matteo Galetta, Antonio La Porta, Bert Jan Offrein, Valeria Bragaglia. 2025-09-17. Analytical Modelling of the Transport in Analog Filamentary Conductive-Metal-Oxide/HfOx ReRAM Devices. https://doi.org/10.1039/d4nh00072b

Cite the original work for its findings. Save a collection to share your selection of sources.

KEEP EXPLORING

Related papers

Whole-Blood Boundary Analysis of BioFET-Based ctDNA Detection for Intravascular Sensing in Intrabody Nanonetworks

Liquid biopsy can detect tumor-derived biomarkers such as circulating tumor DNA (ctDNA), but ultra-low-fraction assays remain costly, slow, and difficult to scale. This motivates interest in intravascular in vivo sensing in the context of intrabody nanonetworks, where nanosensors could support local biomarker monitoring. BioFET-based nanosensors are relevant here because they are label-free, highly miniaturizable, and have shown strong ctDNA sensitivity in controlled media. We examine whether this sensitivity still yields reliable ctDNA detection in whole blood using a reduced-order stochastic simulation model that links operating-point selection, Debye-screened charge transduction, stochastic finite-capacity binding, nonspecific adsorption, background fluctuations, and intrinsic electronic noise to blank-threshold detection. Monte Carlo evaluation with physiologically grounded parameters shows that short Debye length and several-nanometer charge-to-channel separation attenuate the current shift, while low-frequency noise and background fluctuations reduce the margin between target-present and blank responses. Under the tested quasi-static charge-gating regime, the simulated current shifts do not reliably exceed the blank-derived threshold at low ctDNA concentrations. The model therefore provides a whole-blood boundary analysis that identifies which interface configurations and operating conditions most strongly limit reliable BioFET-based intravascular ctDNA detection.

cs.ET

Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration

The scaling of GPUs for AI and HPC workloads is increasingly constrained by the capacity, bandwidth, and thermal limits of both 2.5D HBM-GPU and direct-stacked 3D HBM-on-GPU integration. This work establishes the thermal design envelope for 3D volumetric DRAM-on-GPU integration, in which vertically oriented DRAM dies and interleaved cooling cavities reshape heat flow and memory interfacing above the GPU. Using a package-level thermal model anchored to a consistent HBM-on-GPU baseline and driven by a realistic reticle-scale non-uniform GPU power map, we quantify the key parameters governing thermal feasibility. Stack height is the dominant limiter of peak temperature, while cooling-cavity conductivity shifts the feasible region, and mold insertion and stack orientation further modulate thermal behavior. A distributed memory-controller and network-on-chip tier introduces only a moderate thermal penalty. Although die-level parallelism increases bandwidth, the reduction in simulated training time saturates once execution becomes compute-bound. These results define a bounded co-design space across bandwidth, capacity, and thermal constraints for 3D volumetric DRAM-on-GPU integration.

cs.ET

Droop-Aware Foundation Model Power Flow

This paper develops a droop-aware extension of the GridFM power systems foundation model, embedding droop gains and frequency/voltage deadband parameters as per-bus node features to enable control-aware AC power-flow analysis. Existing power-flow datasets encode only static electrical features, conflating operating points from qualitatively different control regimes; this work resolves that gap by exposing droop and deadband parameters as structured node features, with deadband discontinuities handled through a smooth tanh approximation that preserves solver differentiability. A transformer-based graph neural network is pre-trained on masked reconstruction and fine-tuned on the resulting control-aware datasets. The framework is validated against PSCAD electromagnetic-transient simulations on a two-bus system (0.11% maximum steady-state error) and cross-validated against an independent PyPower droop solver on the IEEE 24-bus RTS. On the 24-bus system the surrogate attains R2 = 0.9996 for active generation and 0.0015 p.u. voltage-magnitude RMSE; scalability is confirmed on the IEEE 300-bus system (0.0036 p.u. RMSE, R2 = 0.9841 for voltage magnitude across 299,700 predictions). A three-mode control study further shows that the deadband widens the control-error distribution while leaving total droop compensation unchanged, establishing deadband width as an actionable node-level design feature.

cs.ET