Search arXivSearch

arXiv · 2608.28343

Denoising-Aware Temporal Point Cloud Completion for 3D Crop Architecture Recovery and Phenotypic Trait Extraction

Abstract

High-throughput phenotyping depends on accurate 3D reconstruction of plants across growth stages, yet the development and evaluation of temporal completion methods are limited by the lack of datasets with complete geometric ground truth. To address this challenge, we introduce SynthCrop4D, a procedurally generated synthetic dataset of temporally evolving plant point clouds that provides controllable noise, occlusion, and complete plant geometry for benchmarking reconstruction methods. Using this dataset, we evaluate a two-stage pipeline that combines spatial denoising and temporal point cloud completion. First, a denoising module removes structural artifacts from raw laser-scanned point clouds. The resulting data are then processed by an Adaptive Temporal PoinTr model that reconstructs the current growth stage (t) using information from the previous stage (t-1), enabling recovery of regions missing due to self-occlusion. We evaluate the proposed framework on both SynthCrop4D and the real-world Pheno4D dataset (tomato and maize) under settings with and without denoising. Results show that denoising substantially improves reconstruction quality, with the best configuration achieving a Chamfer Distance of 0.0061 on SynthCrop4D (Temporal PoinTr + Mamba-DG) and an F-Score of 0.2080 on Pheno4D (Vanilla PoinTr + Mamba-DG). We further demonstrate the use of completed point clouds for phenotypic trait extraction, including plant height, canopy width, and convex hull volume, obtaining hull-volume MAEs of 0.021 on synthetic data and 0.343 on real data. Together, SynthCrop4D and the proposed pipeline provide a benchmark and methodology for temporal plant reconstruction and high-throughput crop phenotyping.

Explore related subjects

Keep this discovery

BibTeXRIS

Mrudul Mittal, Soumyashree Kar. 2026-08-28. Denoising-Aware Temporal Point Cloud Completion for 3D Crop Architecture Recovery and Phenotypic Trait Extraction. https://arxiv.org/abs/2608.28343

Cite the original work for its findings. Save a collection to share your selection of sources.

Discover connections

Connections use source metadata and explicit phrase matches, not verified experimental comparisons.

KEEP EXPLORING

Related discoveries

Texture Image Classification Using DWT AlexNet Feature Fusion and Deep Neural Networks

Texture image classification plays a significant role in computer vision applications, including industrial inspection, medical image analysis, remote sensing, and object recognition. Handcrafted features can capture local texture characteristics but may have limited capability to represent complex visual patterns. In contrast, deep learning models automatically learn discriminative representations but may not fully exploit the multiscale spatial-frequency information inherent in texture images. This paper proposes a hybrid feature fusion framework, termed DWT_AlexNet_DNN, which combines Discrete Wavelet Transform (DWT) features with deep features extracted using AlexNet for texture image classification.

cs.CV

GeBDA: Building Damage Assessment as Text-Based Sequence Prediction

Conventionally, Building Damage Assessment (BDA) is tackled either with dedicated network architectures or by fine-tuning geospatial image foundation models. In this work, we ask whether a general-purpose Vision-Language Model (VLM) can localize buildings and grade their damage through autoregressive sequence generation alone. We cast BDA as predicting a variable-length set of bounding boxes, each specified by its coordinates and a damage label. Our preliminary implementation, based on the open Gemma model, achieves promising damage mapping results from only bi-temporal satellite images and a suitable text prompt.

cs.CV

SePArate: Segmenting Patterns from Defects in Wafer Manufacturing Using Weak Supervision

In semiconductor manufacturing, defect analysis is essential, but manual inspection cannot scale. However, existing automated inspection methods remain insufficient for root-cause analysis and process optimization. To this end, we present SePArate, a weakly supervised wafer defect segmentation method. SePArate enables pixel-level separation of patterns by leveraging only image-level annotations. It consists of a three-phase training: encoder pretraining, knowledge transfer to learn spatial cues, and training on synthetic mixed-defect data for accurate segmentation. Experiments demonstrate that SePArate outperforms the baselines.

cs.CV