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Kechengqi Zhu

Publications and source records attributed to Kechengqi Zhu.

2 recordsLinked to original sources

Quantitative Rules for Parallel Calibration and Drift-Resilient Maintenance of Large-Scale Superconducting Quantum Processors

As superconducting quantum processors scale toward hundreds of qubits, manual calibration becomes increasingly costly and difficult to sustain. Here we address two system-level factors governing automated calibration, namely, crosstalk induced by parallel operations and temporal drift of control parameters. On a 66-qubit superconducting processor, cross-entropy benchmarking shows that single-qubit calibration tolerates full-chip concurrency with minimal fidelity loss, whereas CZ calibration requires a minimum coupler-graph distance of four to avoid elevated control errors. Continuous monitoring of representative qubit and coupler parameters further yields quantitative refresh rules that assign refresh priority by error-budget consumption. These results turn two conventionally heuristic choices, the concurrency density of calibration tasks and the refresh priority of each control parameter, into measurable operating rules. Implemented within an automated calibration framework, the rules support a six-qubit Greenberger-Horne-Zeilinger state with a zero-noise-extrapolated fidelity of 89.64%, distance-dependent logical-error suppression in a single-cycle repetition-code benchmark, and a reduction of the mean single-qubit error from 0.023 to 0.011 on a 337-qubit processor, providing an experimentally grounded reference for the automated calibration and maintenance of current and future large-scale superconducting quantum systems.

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Low-Loss, High-Coherence Airbridge Interconnects Fabricated by Single-Step Lithography

Airbridges are essential for creating high-performance, low-parasitic interconnects in integrated circuits and quantum devices. Conventional multi-step fabrication methods hinder miniaturization and introduce process-related defects. We report a simplified process for fabricating nanoscale airbridges using only a single electron-beam lithography step. By optimizing a multilayer resist stack with a triple-exposure-dose scheme and a thermal reflow step, we achieve smooth, suspended metallic bridges with sub-200-nm features that exhibit robust mechanical stability. Fabricated within a gradiometric SQUID design for superconducting transmon qubits, these airbridges introduce no measurable additional loss in the relaxation time $T_1$, while enabling a 2.5-fold enhancement of the dephasing time $T_2^*$. This efficient method offers a practical route toward integrating high-performance three-dimensional interconnects in advanced quantum and nano-electronic devices.

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