Pilsang Yun | Search arXiv

arXiv2026

Experiments and Modeling of Defect Dynamics and BTI Behavior in Doped InO TFTs during $400^\circ$C Post-Processing Forming Gas Annealing

We investigate the impact of a monolithic three-dimensional (M3D) integration process-critical $400^\circ$C post-processing forming gas anneal (FGA) on the electrical performance, reliability, and defect evolution of oxide-channel thin-film transistors (TFTs), combining systematic experiments with density-functional-theory (DFT)-based liquid-quench molecular-dynamics (MD) simulations. Indium tungsten oxide (IWO) TFTs are employed as a model system and encapsulated with a thin 3 nm Al$_2$O$_3$ / 3 nm HfO$_2$ hybrid layer that effectively suppresses external hydrogen ingress. We reveal a non-monotonic evolution of device behavior during FGA, governed by initial densification followed by partial crystallization. Short-duration FGA (10 min) induces channel densification and the formation of shallow, delocalized defect states, leading to pronounced positive bias temperature instability (PBTI) degradation and the emergence of a characteristic transfer-curve "kink." With prolonged annealing (>40 min), partial crystallization of the oxide channel occurs, stabilizing hydrogen in deep, localized defect states, suppressing hydrogen mobility, and restoring device reliability. As a result, the PBTI shift is reduced to 10.4 mV after 2000 seconds of stress, accompanied by complete elimination of the transfer-curve kink. These findings provide a mechanistic understanding of hydrogen-defect interactions during high-temperature post-processing FGA and demonstrate that appropriate hydrogen-blocking encapsulation enables oxide-channel TFT integration without compromising electrical performance or reliability.

cond-mat.mtrl-sci↗

arXiv2026

Shallow Trap States Control Electrical Performance of Amorphous Oxide Semiconductor Thin-Film Transistors

The performance of n-type amorphous oxide semiconductor thin-film transistors (TFTs) is largely controlled by the density of states (DoS) near the conduction band mobility edge. Here, the full subgap DoS of amorphous InGaZnO (a-IGZO) TFTs, used in display panels and dynamic random-access memory (DRAM) development, is measured by ultrabroadband photoconduction (UP-DoS) microscopy to within 0.1 eV of the mobility edge. The measured subgap DoS for 25 TFT processing conditions accurately predicts each transfer curve, showing how shallow defect states are electron traps that rigidly tune subthreshold swing, threshold voltage and drift mobility. For a set of TFTs, the subthreshold transfer characteristics can be independently simulated from the experimental shallow defect DoS, with no adjustable parameters. The full transfer curve is simulated by introducing a single parameter: the conduction band tail energy. Additionally, the simulation reveals that the shallow trap density controlling subthreshold behavior can be directly extracted from transfer curves. Finally, a systematic In-enrichment study, combined with DFT+U DoS simulations, enables identification of vacancy cation coordination environments for all experimentally observed subgap peaks. The dominant trap controlling conventional a-IGZO TFT performance is centered at ~0.32 eV below the conduction band mobility edge and is assigned to a Ga-Ga-In oxygen vacancy defect.

physics.app-ph↗