arXiv subjects

Simone Assali

Publications and source records attributed to Simone Assali.

At least 19 recordsLinked to original sources

arXiv2026

Magneto-optical characterization of GeSn and GeSn/SiGeSn heterostructures

Hole spin qubits in germanium (Ge)-based heterostructures have demonstrated their potential for scalable quantum information processing using all-electrical gate operations. Furthermore, the emerging material platform of germanium-tin (GeSn) can feature a direct bandgap, which makes it promising for establishing spin-photon interfaces for quantum networking. Here, we perform magneto-photoluminescence measurements of a Ge0.88Sn0.12/Si0.02Ge0.89Sn0.09 double quantum well using the double modulation Fourier transform infrared-based photoluminescence spectroscopy. Our measurements reveal theoretically expected diamagnetic shift at low magnetic fields as well as the linear trend of zeroth-level Landau quantization at higher fields and Zeeman-induced polarization-dependent energy shifts at +/- 12 T. We extract an effective g-factor of ~ 2 and an excitonic reduced mass of ~ 0.04 me consistent with previous estimations for heavy-hole {\Gamma}-valley excitons. The observation of sizable Zeeman splitting is consistent with strong spin-orbit interaction in Ge-based hole systems, which can enable electrically driven spin control. Our analysis can be adopted for studying and evaluating group-IV semiconductor heterostructures as hosts for hole spin qubits toward scalable quantum information processing.

quant-ph↗

arXiv2026

Mid-Infrared Thermal Radiation Harvesting using Uncooled Narrow Bandgap GeSn Thermophotovoltaic cell

Thermophotovoltaic (TPV) cells are increasingly attractive for applications in industrial waste heat harvesting, aerospace energy management, and compact power generation. Deploying midwave-infrared (MWIR) TPV in practical applications requires narrow-bandgap semiconductors that not only absorb low-energy photons but also integrate with scalable, low-cost platforms. Although high-performance TPV devices have been demonstrated using III-V materials such as InAs, GaSb, and InGaAs(P), their use remains limited by cost and substrate size. With this perspective, narrow bandgap GeSn alloys are a promising alternative that extend group-IV absorption into the MWIR while being silicon-compatible. Although the potential of GeSn TPV cells has been predicted, no experimental demonstration has been reported. Here, proof-of-concept Ge$_{0.91}$Sn$_{0.09}$ p-i-n TPV diodes (1 mm diameter) grown on silicon were fabricated and their performance was benchmarked against commercial InAs and extended-InGaAs devices. Measurements at 300 K under 2.33 $\mu$m laser and $\sim$1500 K SiC Globar illumination revealed peak responsivity of $\sim$ 0.2 A/W at $\sim$ 1.7 $\mu$m, and an output power of $\sim$ 0.41 mW/cm$^2$. These devices show trends comparable to those of the InAs diode under identical conditions, although at reduced absolute levels. To assess the intrinsic performance potential, Poisson-drift-diffusion modeling incorporating experimentally calibrated emitter emissivity predicts power densities exceeding 1 W/cm$^2$ under moderate MWIR thermal illumination, indicating that the present devices operate far below their fundamental limits and are primarily constrained by defect-assisted recombination and transport losses. These results establish GeSn as a scalable, silicon-compatible MWIR TPV platform and highlight a larger performance potential achievable through material and device optimization.

physics.app-ph↗

arXiv2025

Spontaneous Transition from Conformal to Two-Dimensional Growth in Ge/GeSn Core/Shell Nanowires

GeSn semiconductors are group-IV isovalent alloys that offer remarkable tunability of optoelectronic properties across the entire infrared spectrum, while remaining fully compatible with silicon processing standards. These attributes make GeSn a promising platform for scalable sensing, imaging, and communication technologies. Yet, the influence of dimensionality on GeSn crystal growth remains poorly understood, limiting the development of integrated nanoscale infrared devices. Here, we reveal the spontaneous formation of hitherto unreported ultra-thin GeSn fins with sub-30 nm thickness during vapor-phase growth on Ge nanowire substrates. A transition from the typical conformal GeSn shell to distinct fin-like structures occurs along the nanowire growth axis and is accompanied by ordered twin defects extending longitudinally and laterally, inducing a transition from diamond to hexagonal-like crystal structure. The fins exhibit uniform Sn incorporation of approximately 16 at.% throughout their volume, indicating high compositional homogeneity. These findings uncover an anisotropic growth regime in metastable GeSn alloys, enriching the fundamental understanding of nanoscale epitaxy.

cond-mat.mtrl-sci↗

arXiv2025

Polarization-sensitive GeSn Mid-Infrared Membrane Photodetectors with Integrated Plasmonic Metasurface

Germanium-Tin (GeSn) semiconductors are promising for mid-infrared optoelectronics owing to their silicon compatibility, tunable bandgap, and potential for room-temperature operation. Released GeSn membranes provide an additional degree of freedom to extend the operation wavelength through epitaxial strain relaxation, while their transferability expands design flexibility. On the other hand, metasurfaces have become an effective strategy to engineer light--matter interaction, and their integration with photodetectors can enhance performance and introduce new functionalities. Here, we demonstrate a mid-infrared photodetector consisting of a transfer-printed Ge$_{0.89}$Sn$_{0.11}$ membrane integrated with an Au plasmonic metasurface. The photodetector exhibits a wavelength cutoff exceeding 3.0~$\mu$m with nearly fourfold increase in responsivity at 2.5~$\mu$m as compared to unreleased films, attributed to Fabry--P\'erot resonance. Furthermore, the integration with an anisotropic metasurface yields detectors with strong polarization sensitivity, achieving a measured contrast ratio of $\sim$4:1 between orthogonal polarizations. Moreover, the operation wavelength of the photodetector can be selectively tuned by varying the geometric scale of the metasurface. The experimental results show excellent agreement with simulations, confirming the effectiveness and versatility of this integrated metasurface--membrane design.

physics.app-ph↗

arXiv2025

Waveguide-Coupled Mid-Infrared GeSn Membrane Photodetectors on Silicon-on-Insulator

Silicon photonics has thrived in telecommunications over recent decades, and its extension to the mid-infrared range has the potential to unlock valuable opportunities for sensing, imaging, and free-space communications. With this perspective, germanium-tin (GeSn) alloy has been extensively investigated as a silicon-compatible semiconductor with bandgap tunability that covers this entire spectral range. Indeed, a variety of GeSn-based high-performance optoelectronic devices have been demonstrated, confirming the potential of this system for mid-infrared applications. However, the integration of these devices onto silicon photonic platforms remains underexplored. Herein, we demonstrate the fabrication and integration, through transfer-printing, of strain-relaxed GeSn membranes onto silicon-on-insulator waveguides to create integrated detectors operating up to 3.1 $\mu$m at room temperature. Two different designs of waveguide structures are evaluated to study the coupling efficiency between the passive structures and the active membrane detector. A responsivity reaching 0.36 A/W at an operation wavelength of 2.33 $\mu$m is measured under a bias of 1 V. Moreover, the fabrication resulted in multiple working devices exhibiting similar performance using a single transfer printing step, demonstrating the scalability of the proposed approach.

physics.app-ph↗

arXiv2024

Mid-infrared group-IV nanowire laser

Semiconductor nanowires have shown great potential for enabling ultra-compact lasers for integrated photonics platforms. Despite the impressive progress in developing nanowire lasers, their integration into Si photonics platforms remains challenging largely due to the use of III-V and II-VI semiconductors as gain media. These materials not only have high material costs, but also require inherently complex integration with Si-based fabrication processing, increasing overall costs and thereby limiting their large-scale adoption. Furthermore, these material-based nanowire lasers rarely emit above 2 um, which is a technologically important wavelength regime for various applications in imaging and quantum sensing. Recently, group-IV nanowires, particularly direct bandgap GeSn nanowires capable of emitting above 2 um, have emerged as promising cost-effective gain media for Si-compatible nanowire lasers, but there has been no successful demonstration of lasing from this seemingly promising nanowire platform. Herein, we report the experimental observation of lasing above 2 um from a single bottom-up grown GeSn nanowire. By harnessing strain engineering and optimized cavity designs simultaneously, the single GeSn nanowire achieves an amplified material gain that can sufficiently overcome minimized optical losses, resulting in a single-mode lasing with an ultra-low threshold of ~5.3 kW cm-2. Our finding paves the way for all-group IV mid-infrared photonic-integrated circuits with compact Si-compatible lasers for on-chip classical and quantum sensing and free-space communication.

physics.optics↗

arXiv2024

Transfer-printed multiple Ge$_{0.89}$Sn$_{0.11}$ membrane mid-infrared photodetectors

Due to their narrow band gap and compatibility with silicon processing, germanium-tin (Ge$_{1-x}$Sn$_x$) alloys are a versatile platform for scalable integrated mid-infrared photonics. These semiconductors are typically grown on silicon wafers using Ge as an interlayer. However, the large lattice mismatch in this heteroepitaxy protocol leads to the build-up of compressive strain in the grown layers. This compressive strain limits the material quality and its thermal stability besides expanding the band gap, thereby increasing the Sn content needed to cover a broader range in the mid-infrared. Released Ge$_{1-x}$Sn$_x$ membranes provide an effective way to mitigate these harmful effects of the epitaxial strain and control the band gap energy while enabling the hybrid integration onto different substrates. With this perspective, herein strain-relaxed Ge$_{0.89}$Sn$_{0.11}$ membranes are fabricated and subsequently transfer-printed with metal contacts to create multiple photodetectors in a single transfer step. The resulting photodetectors exhibit an extended photodetection cutoff reaching a wavelength of $3.1 \,\mu$m, coupled with a significant reduction in the dark current of two orders of magnitude as compared to as-grown photoconductive devices. The latter yields a reduced cutoff of $2.8 \,\mu$m due to the inherent compressive strain. Furthermore, the impact of chemical treatment and annealing on the device performance was also investigated showing a further reduction in the dark current. The demonstrated transfer printing, along with the use of an adhesive layer, would allow the transfer of multiple GeSn membranes onto virtually any substrate. This approach paves the way for scalable fabrication of hybrid optoelectronic devices leveraging the tunable band gap of Ge$_{1-x}$Sn$_x$ in the mid-wave infrared range.

physics.app-ph↗

arXiv2024

Extended-SWIR High-Speed All-GeSn PIN Photodetectors on Silicon

There is an increasing need for silicon-compatible high bandwidth extended-short wave infrared (e-SWIR) photodetectors (PDs) to implement cost-effective and scalable optoelectronic devices. These systems are quintessential to address several technological bottlenecks in detection and ranging, surveillance, ultrafast spectroscopy, and imaging. In fact, current e-SWIR high bandwidth PDs are predominantly made of III-V compound semiconductors and thus are costly and suffer a limited integration on silicon besides a low responsivity at wavelengths exceeding $2.3 \,\mu$m. To circumvent these challenges, Ge$_{1-x}$Sn$_{x}$ semiconductors have been proposed as building blocks for silicon-integrated high-speed e-SWIR devices. Herein, this study demonstrates a vertical all-GeSn PIN PDs consisting of p-Ge$_{0.92}$Sn$_{0.08}$/i-Ge$_{0.91}$Sn$_{0.09}$/n-Ge$_{0.89}$Sn$_{0.11}$ and p-Ge$_{0.91}$Sn$_{0.09}$/i-Ge$_{0.88}$Sn$_{0.12}$/n-Ge$_{0.87}$Sn$_{0.13}$ heterostructures grown on silicon following a step-graded temperature-controlled epitaxy protocol. The performance of these PDs was investigated as a function of the device diameter in the $10-30 \,\mu$m range. The developed PD devices yield a high bandwidth of 12.4 GHz at a bias of 5V for a device diameter of $10 \,\mu$m. Moreover, these devices show a high responsivity of 0.24 A/W, a low noise, and a $2.8 \,\mu$m cutoff wavelength thus covering the whole e-SWIR range.

physics.app-ph↗

arXiv2023

Mid-infrared top-gated Ge/Ge$_{0.82}$Sn$_{0.18}$ nanowire phototransistors

Achieving high crystalline quality Ge$_{1-x}$Sn$_{x}$ semiconductors at Sn content exceeding 10\% is quintessential to implementing the long sought-after silicon-compatible mid-infrared photonics. Herein, by using sub-20 nm Ge nanowires as compliant growth substrates, Ge$_{1-x}$Sn$_{x}$ alloys with a Sn content of 18\% exhibiting a high composition uniformity and crystallinity along a few micrometers in the nanowire growth direction were demonstrated. The measured bandgap energy of the obtained Ge/Ge$_{0.82}$Sn$_{0.18}$ core/shell nanowires is 0.322 eV enabling the mid-infrared photodetection with a cutoff wavelength of 3.9 $\mu$m. These narrow bandgap nanowires were also integrated into top-gated field-effect transistors and phototransistors. Depending on the gate design, these demonstrated transistors were found to exhibit either ambipolar or unipolar behavior with a subthreshold swing as low as 228 mV/decade measured at 85 K. Moreover, varying the top gate voltage from -1 V to 5 V yields nearly one order of magnitude increase in the photocurrent generated by the nanowire phototransistor under a 2330 nm illumination. This study shows that the core/shell nanowire architecture with a super thin core not only mitigates the challenges associated with strain buildup observed in thin films but also provides a promising platform for all-group IV mid-infrared photonics and nanoelectronics paving the way toward sensing and imaging applications.

physics.optics↗

arXiv2023

Mid-Infrared Detectors and Imagers Integrating All-Group IV Nanowires

Cost-effective mid-wave infrared (MWIR) optoelectronic devices are of utmost importance to a plethora of applications such as night vision, thermal sensing, autonomous vehicles, free-space communication, and spectroscopy. To this end, leveraging the ubiquitous silicon-based processing has emerged as a powerful strategy that can be accomplished through the use of group IV germanium-tin (GeSn) alloys. Indeed, due to their compatibility with silicon and their tunable bandgap energy covering the entire MWIR range, GeSn semiconductors are frontrunner platforms for compact and scalable MWIR technologies. However, the GeSn large lattice parameter has been a major hurdle limiting the quality of GeSn epitaxy on silicon wafers. Herein, it is shown that sub-20 nm Ge nanowires (NWs) provide effective compliant substrates to grow Ge$_{1-x}$Sn$_{x}$ alloys with a composition uniformity over several micrometers with a very limited build-up of the compressive strain. Ge/Ge$_{1-x}$Sn$_{x}$ core/shell NWs with Sn content spanning the 6 to 18 at.$\%$ range are demonstrated and integrated in photoconductive devices exhibiting a high signal-to-noise ratio at room temperature and a tunable cutoff wavelength covering the 2.0 $\mu$m to 3.9 $\mu$m range. Additionally, the processed NW-based detectors were used in uncooled imagers enabling the acquisition of high-quality images under both broadband and laser illuminations without a lock-in technique.

cond-mat.mes-hall↗

arXiv2023

Continuous-wave GeSn light emitting diodes on silicon with $2.5 \, \mu$m room-temperature emission

Silicon-compatible short- and mid-wave infrared emitters are highly sought-after for on-chip monolithic integration of electronic and photonic circuits to serve a myriad of applications in sensing and communication. To address this longstanding challenge, GeSn semiconductors have been proposed as versatile building blocks for silicon-integrated optoelectronic devices. In this regard, this work demonstrates light-emitting diodes (LEDs) consisting of a vertical PIN double heterostructure p-Ge$_{0.94}$Sn$_{0.06}$/i-Ge$_{0.91}$Sn$_{0.09}$/n-Ge$_{0.95}$Sn$_{0.05}$ grown epitaxially on a silicon wafer using germanium interlayer and multiple GeSn buffer layers. The emission from these GeSn LEDs at variable diameters in the 40-120 $\mu$m range is investigated under both DC and AC operation modes. The fabricated LEDs exhibit a room temperature emission in the extended short-wave range centered around 2.5 $\mu$m under an injected current density as low as 45 A/cm$^2$. By comparing the photoluminescence and electroluminescence signals, it is demonstrated that the LED emission wavelength is not affected by the device fabrication process or heating during the LED operation. Moreover, the measured optical power was found to increase monotonically as the duty cycle increases indicating that the DC operation yields the highest achievable optical power. The LED emission profile and bandwidth are also presented and discussed.

physics.optics↗

arXiv2023

Extended-SWIR GeSn LEDs with reduced footprint and power consumption

CMOS-compatible short- and mid-wave infrared emitters are highly coveted for the monolithic integration of silicon-based photonic and electronic integrated circuits to serve a myriad of applications in sensing and communications. In this regard, a group IV germanium-tin (GeSn) material epitaxially grown on silicon (Si) emerges as a promising platform to implement tunable infrared light emitters. Indeed, upon increasing the Sn content, the bandgap of GeSn narrows and becomes direct, making this material system suitable for developing an efficient silicon-compatible emitter. With this perspective, microbridge PIN GeSn LEDs with a small footprint of $1,520$ $\mu$m$^2$ are demonstrated and their operation performance is investigated. The spectral analysis of the electroluminescence emission exhibits a peak at $2.31$ $\mu$m and it red-shifts slightly as the driving current increases. It is found that the microbridge LED operates at a dissipated power as low as $10.8$ W at room temperature and just $3$ W at $80$ K. This demonstrated low operation power is comparable to that reported for LEDs having a significantly larger footprint reaching $10^6$ $\mu$m$^2$. The efficient thermal dissipation of the current design helped to reduce the heat-induced optical losses, thus enhancing light emission. Further performance improvements are envisioned through thermal and optical simulations of the microbridge design. The use of GeSnOI substrate for developing a similar device is expected to improve optical confinement for the realization of electrically driven GeSn lasers.

physics.optics↗

arXiv2023

Radiative Carrier Lifetime in Ge$_{1-x}$Sn$_x$ Mid-Infrared Emitters

Ge$_{1-x}$Sn$_x$ semiconductors hold the premise for large-scale, monolithic mid-infrared photonics and optoelectronics. However, despite the successful demonstration of several Ge$_{1-x}$Sn$_x$-based photodetectors and emitters, key fundamental properties of this material system are yet to be fully explored and understood. In particular, little is known about the role of the material properties in controlling the recombination mechanisms and their consequences on the carrier lifetime. Evaluating the latter is in fact fraught with large uncertainties that are exacerbated by the difficulty to investigate narrow bandgap semiconductors. To alleviate these limitations, herein we demonstrate that the radiative carrier lifetime can be obtained from straightforward excitation power- and temperature- dependent photoluminescence measurements. To this end, a theoretical framework is introduced to simulate the measured spectra by combining the band structure calculations from the k.p theory and the envelope function approximation (EFA) to estimate the absorption and spontaneous emission. Based on this model, the temperature-dependent emission from Ge$_{0.83}$Sn$_{0.17}$ samples at a biaxial compressive strain of $-1.3\%$ was investigated. The simulated spectra reproduce accurately the measured data thereby enabling the evaluation of the steady-state radiative carrier lifetimes, which are found in the 3-22 ns range for temperatures between 10 and 300 K at an excitation power of 0.9 kW/cm$^2$. For a lower power of 0.07 kW/cm$^2$, the obtained lifetime has a value of 1.9 ns at 4 K. The demonstrated approach yielding the radiative lifetime from simple emission spectra will provide valuable inputs to improve the design and modeling of Ge$_{1-x}$Sn$_x$-based devices.

physics.app-ph↗

arXiv2022

Polarization-Tuned Fano Resonances in All-Dielectric Short-Wave Infrared Metasurface

The short-wave infrared (SWIR) is an underexploited portion of the electromagnetic spectrum in metasurface-based nanophotonics despite its strategic importance in sensing and imaging applications. This is mainly attributed to the lack of material systems to tailor light-matter interactions in this range. Herein, we address this limitation and demonstrate an all-dielectric silicon-integrated metasurface enabling polarization-induced Fano resonance control at SWIR frequencies. The platform consists of a two-dimensional Si/GeSn core/shell nanowire array on a silicon wafer. By tuning the light polarization, we show that the metasurface reflectance can be efficiently engineered due to Fano resonances emerging from the electric and magnetic dipoles competition. The interference of optically induced dipoles in high-index nanowire arrays offers additional degrees of freedom to tailor the directional scattering and the flow of light while enabling sharp polarization-modulated resonances. This tunability is harnessed in nanosensors yielding an efficient detection of 10^{-2} changes in the refractive index of the surrounding medium.

physics.optics↗

arXiv2022

500-period epitaxial Ge/Si0.18Ge0.82 multi-quantum wells on silicon

Ge/SiGe multi-quantum well heterostructures are highly sought-after for silicon-integrated optoelectronic devices operating in the broad range of the electromagnetic spectrum covering infrared to terahertz wavelengths. However, the epitaxial growth of these heterostructures at a thickness of a few microns has been a challenging task due the lattice mismatch and its associated instabilities resulting from the formation of growth defects. To elucidates these limits, we outline herein a process for the strain-balanced growth on silicon of 11.1 nm/21.5 nm Ge/Si0.18Ge0.82 superlattices (SLs) with a total thickness of 16 {\mu}m corresponding to 500 periods. Composition, thickness, and interface width are preserved across the entire SL heterostructure, which is an indication of limited Si-Ge intermixing. High crystallinity and low defect density are obtained in the Ge/Si0.18Ge0.82 layers, however, the dislocation pile up at the interface with the growth substate induces micrometer-longs cracks on the surface. This eventually leads to significant layer tilt in the strain-balanced SL and in the formation of millimeter-long, free-standing flakes. These results confirm the local uniformity of structural properties and highlight the critical importance of threading dislocations in shaping the wafer-level stability of thick multi-quantum well heterostructures required to implement effective silicon-compatible Ge/SiGe photonic devices.

cond-mat.mtrl-sci↗

arXiv2022

Dark current in monolithic extended-SWIR GeSn PIN photodetectors

The monolithic integration of extended short-wave infrared (e-SWIR) photodetectors (PDs) on silicon is highly sought-after to implement manufacturable, cost-effective sensing and imaging technologies. With this perspective, GeSn PIN PDs have been the subject of extensive investigations because of their bandgap tunability and silicon compatibility. However, due to growth defects, these PDs suffer a relatively high dark current density as compared to commercial III-V PDs. Herein, we elucidate the mechanisms governing the dark current in $2.6 \, \mu$m GeSn PDs at a Sn content of $10$ at.%. It was found that in the temperature range of $293 \, $K -- $363 \,$K and at low bias, the diffusion and Shockley-Read-Hall (SRH) leakage mechanisms dominate the dark current in small diameter ($20 \, \mu$m) devices, while combined SRH and trap assisted tunneling (TAT) leakage mechanisms are prominent in larger diameter ($160 \, \mu$m) devices. However, at high reverse bias, TAT leakage mechanism becomes dominant regardless of the operating temperature and device size. The effective non-radiative carrier lifetime in these devices was found to reach $\sim 300$ -- $400$ ps at low bias. Owing to TAT leakage current, however, this lifetime reduces progressively as the bias increases.

physics.app-ph↗

arXiv2022

Ge-Ge$_{0.92}$Sn$_{0.08}$ core-shell single nanowire infrared photodetector with superior characteristics for on-chip optical communication

Recent development on Ge$_{1-x}$Sn$_x$ nanowires with high Sn content, beyond its solid solubility limit, make them attractive for all group-IV Si-integrated infrared photonics at nanoscale. Herein, we report a chemical vapour deposition-grown high Sn-content Ge-Ge$_{0.92}$Sn$_{0.08}$ core-shell based single nanowire photodetector operating at the optical communication wavelength of 1.55 $\mu$m. The atomic concentration of Sn in nanowires has been studied using X-ray photoelectron and Raman spectroscopy data. A metal-semiconductor-metal based single nanowire photodetector, fabricated via electron beam lithography process, exhibits significant room-temperature photoresponse even at zero bias. In addition to the high-crystalline quality and identical shell composition of the nanowire, the efficient collection of photogenerated carriers under an external electric field result in the superior responsivity and photoconductive gain as high as ~70.8 A/W and ~57, respectively at an applied bias of -1.0 V. The extra-ordinary performance of the fabricated photodetector demonstrates the potential of GeSn nanowires for future Si CMOS compatible on-chip optical communication device applications.

cond-mat.mtrl-sci↗

arXiv2021

A Light-Hole Quantum Well on Silicon

The quiet quantum environment of holes in solid-state devices has been at the core of increasingly reliable architectures for quantum processors and memories.1-6 However, due to the lack of scalable materials to properly tailor the valence band character and its energy offsets, the precise engineering of light-hole (LH) states remains a serious obstacle toward coherent photon-spin interfaces needed for a direct mapping of the quantum information encoded in photon flying qubits to stationary spin processor.4-9 Herein, to alleviate this long-standing limitation we demonstrate an all-group IV low-dimensional system consisting of highly tensile strained germanium quantum well grown on silicon allowing new degrees of freedom to control and manipulate the hole states. Wafer-level, high bi-isotropic in-plane tensile strain ($>1\%$) is achieved using strain-engineered, metastable germanium-tin alloyed buffer layers yielding quantum wells with LH ground state, high $g$-factor anisotropy, and a tunable splitting of the hole subbands. The epitaxial heterostructures display sharp interfaces with sub-nanometer broadening and show room-temperature excitonic transitions that are modulated and extended to the mid-wave infrared by controlling strain and thickness. This ability to engineer quantum structures with LH selective confinement and controllable optical response enables manufacturable silicon-compatible platforms relevant to integrated quantum communication and sensing technologies.

cond-mat.mes-hall↗