arXiv · 1210.3655
Reliable transport through a microfabricated X-junction surface-electrode ion trap
Abstract
We report the design, fabrication, and characterization of a microfabricated surface-electrode ion trap that supports controlled transport through the two-dimensional intersection of linear trapping zones arranged in a ninety-degree cross. The trap is fabricated with very-large-scalable-integration (VLSI) techniques which are compatible with scaling to a larger quantum information processor. The shape of the radio-frequency (RF) electrodes is optimized with a genetic algorithm to minimize axial pseudopotential barriers and to minimize ion heating during transport. Seventy-eight independent DC control electrodes enable fine control of the trapping potentials. We demonstrate reliable ion transport between junction legs, trapping of ion chains with nearly-equal spacing in one of the trap's linear sections, and merging and splitting ions from these chains. Doppler-cooled ions survive more than 10^5 round-trip transits between junction legs without loss and more than sixty-five consecutive round trips without laser cooling.
Explore related subjects
Keep this discovery
Kenneth Wright, Jason M. Amini, Daniel L. Faircloth, Curtis Volin, S. Charles Doret, Harley Hayden, C. -S. Pai, David W. Landgren, Douglas Denison, Tyler Killian, Richart E. Slusher, Alexa W. Harter. 2012-10-12. Reliable transport through a microfabricated X-junction surface-electrode ion trap. https://doi.org/10.1088/1367-2630%2F15%2F3%2F033004
Cite the original work for its findings. Save a collection to share your selection of sources.