High Thermal Conductivity of Back-End-of-Line Compatible Diamond Films

Abstract

Back-end-of-line (BEOL) thermal management requires electrically insulating heat-spreading dielectric that can be integrated within thermal budgets below 400 C. Here, we report polycrystalline diamond films grown directly on Si at a substrate temperature below 400C. Two films with average thickness of 760 and 1000 nm were characterized by Raman spectroscopy, scanning electron microscopy (SEM), and time-domain thermoreflectance (TDTR). Raman spectra show a sharp diamond peak with minor signatures of non-diamond carbon, while SEM reveals lateral growth and large grain size. Temperature dependent TDTR measurements were performed from room temperature to 100C. Sensitivity analysis indicates that the sensitivity of cross-plane thermal conductivity is comparative to the in-plane thermal conductivity. Accordingly, the films were analyzed using an isotropic thermal model by considering the nearly-isotropic grain structure, yielding room temperature effective thermal conductivity of 73 and 86 W m-1 K-1, respectively. These values are about two orders of magnitude higher than those of conventional dielectric materials and demonstrate the potential of diamond films grown at low temperatures as dielectric heat-spreading layers.