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arXiv · cond-mat/0503479

Fast Diffusion Mechanism of Silicon Tri-interstitial Defects

Abstract

We reveal the microscopic self-diffusion process of compact tri-interstitials in silicon using a combination of molecular dynamics and nudged elastic band methods. We find that the compact tri-interstitial moves by a collective displacement, involving both translation and rotation, of five atoms in a screw-like motion along $[111]$ directions. The elucidation of this pathway demonstrates the utility of combining tight-binding molecular dynamics with \textit{ab initio} density functional calculations to probe diffusion mechanisms. Using density functional theory to obtain diffusion barriers and the prefactor, we calculate a diffusion constant of $ 4 \cdot 10^{-5} \exp (- 0.49 {\rm eV} / k_{B} T) {\rm cm^2/s} $. Because of the low diffusion barrier, $I_{3}^{b}$ diffusion may be an important process under conditions such as ion implantation that creates excess interstitials, hence favoring formation of interstitial clusters.

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Yaojun A. Du, Stephen A. Barr, Kaden R. A. Hazzard, Thomas J. Lenosky, Richard G. Hennig, John W. Wilkins. 2005-06-18. Fast Diffusion Mechanism of Silicon Tri-interstitial Defects. https://doi.org/10.1103/physrevb.72.241306

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