Wafer-scale Semiconductor Grafting: Enabling High-Performance, Lattice-Mismatched Heterojunctions

Abstract

Semiconductor heterojunctions are foundational to many advanced electronic and optoelectronic devices. However, achieving high-quality, lattice-mismatched interfaces remains challenging, limiting both scalability and device performance. Semiconductor grafting offers a promising solution by directly forming electrically active, lattice-mismatched heterojunctions between dissimilar materials. However, its scalability and uniformity at the wafer level have yet to be demonstrated. This work demonstrates the achievement of highly uniform, reproducible results across silicon, sapphire, and gallium nitride (GaN) substrates using wafer-scale semiconductor grafting. To illustrate this scalability, we conducted an in-depth study of a grafted Si/GaN heterojunction, examining band alignment through X-ray photoelectron spectroscopy and confirming crystallinity and interfacial integrity with scanning transmission electron microscopy. The resulting p-n diodes exhibit significantly enhanced electrical performance and wafer-scale uniformity compared to conventional approaches. This work establishes wafer-scale semiconductor grafting as a versatile and scalable technology, bridging the gap between laboratory-scale research and industrial manufacturing for heterogeneous semiconductor integration, and paving the way for novel, high-performance electronic and optoelectronic devices.